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■ Features 1)Solder alloy composition is Sn3Ag0.5Cu. 2)Specially developed flux system ensures EXCELLENT and CONSISTENT ICT TESTABILITY. 3)Carefully selected flux chemistry ensures extremely LOW VOID formation. 4)PERFECT MELTING and WETTING at super fine pitch (<0.4mm pitch) and micro components (<0.35mm dia. CSP, 0603 chip). 5)Low color and crack free flux residues offer SUPERIOR COSMETIC appearance. |
| ■ Specifications |
| Application | Printing - Stencil | |||
| Product | S3X58-M650-3 | S3X58-M650H-3 | ||
| Alloy | Composition (%) | Sn96.5, Ag3.0, Cu0.5 | ||
| Melting point (°C) | 217 - 218 | |||
| Shape | Spherical | |||
| Particle size (μm) | 20 - 38 | |||
| Flux | Halide content (%) | 0.0 | ||
| Surface insulation resistance *1 |
Initial value (Ω) | > 1 × 1013 | ||
| After humidification (Ω) | > 1 × 1012 | |||
| Aqueous solution resistivity*2 (Ω cm) | > 5 × 104 | |||
| Flux type | ROL0 | |||
| Product | Flux content (%) | 12 | 11.7 | |
| Viscosity*3 (Ps.S) | 170 | 200 | ||
| Copper plate corrosion*4 | Passed | |||
| Solder spread factor (%) | > 85 | |||
| Tack time | > 48 hours | |||
| Shelf life (below 10°C) | 6 months | |||
| Other alloy options |
TS58- : SnAg3.5 |
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| 1. SIR 40°C×90%RH×96Hr 2. Aqueous solution resistivity In accordance with MIL specifications. 3. Viscosityalcom spiral type viscometer, PCU-205 at 25°C 10rpm 4. Copper plate corrosionIn accordance with JIS. |
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